應(yīng)屆生硬件工程師英文簡歷
硬件工程師Hardware Engineer職位 要求熟悉計(jì)算機(jī)市場行情;制定計(jì)算機(jī)組裝計(jì)劃;能夠選購組裝需要的`硬件設(shè)備，并能合理配置、安裝計(jì)算機(jī)和外圍設(shè)備;安裝和配置計(jì)算機(jī)軟件系統(tǒng);保養(yǎng)硬件和外圍設(shè)備;清晰描述出現(xiàn)的計(jì)算機(jī)軟硬件故障。下面是CN人才網(wǎng)給大家?guī)淼膽?yīng)屆生硬件工程師英文簡歷，歡迎閱讀。
| Name：CNrencai | Hukou： | |||||
| Residency：Shanghai | Work Experience： | |||||
| Current Salary： | Tel： | |||||
| E-mail： | ||||||
| Career Objective | ||||||
| Desired Industry： | Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, Certification | |||||
| Desired Position： | Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist Staff | |||||
| Desired address： | Shanghai ,Hongkong ,Beijing ,Taiwan ,Macao | Desired Salary： | Negotiable | |||
| Work Experience | ||||||
| 2006/06—Present | ***Company | |||||
|
Industry: Electronics/Semiconductor/IC Intel Flash Engineering Department Individual Contributor Responsibilities： I have been working in Intel Flash Assembly & Test Engineering Department as an Individual Contributor since June of 2006. Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off: 1. The yield of year 2006 has been dramatically increased than that of year 2005. 2. The yield of all products, consecutively meets the goal. 3. The total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007. Report Directly to: Department ManagerNumber of Subordinate: 14 Reference: Bao Powel Achievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off: 1. The yield of year 2006 has been dramatically increased than that of year 2005. 2. The yield of all products, consecutively meets the goal. 3. The total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007. |
||||||
| 2006/01—2006/05 | Intel(Shanghai) Technology Development Ltd.Company | |||||
|
Industry: Electronics/Semiconductor/IC Intel STTD-China Department Electronics Development Engineer Responsibilities： 1. I had been working in STTD-China since Jan 2006 to May 2006 as a senior module engineer. 2. At that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time. Report Directly to: Hopman Mark Number of Subordinate: 14 Reference: Bao Powel Reason for Leaving: I was transferred to Intel（Shanghai）Products Ltd. Company due to the internal re-organization in June of 2006. Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle. |
||||||
| 2005/05—2006/01 | Nanyang University of Science & Technology | |||||
|
Industry: Electronics/Semiconductor/IC Electronics & Electrical Engineering Department Research Fellow Responsibilities： 1. I work in Electronics & Electrical Engineering Department of Nanyang University of Science & Technology as a Research Fellow. 2. I majored at Gate Oxide Reliability Research in the duration. Report Directly to: Professor Pey Kin Leoh Subordinate: 3 Reference: Patrick Low Reason for Leaving: I completed the project which I undertook by myself, and want to do more challenging job. Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself. |
||||||
| Project Experience | ||||||
| 2008/01—Present | Assembly NPI (New Product Introduction) | |||||
|
Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it. Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the progress. |
||||||
| 2007/01—2007/12 | Marginal Electrical Boards Rescue | |||||
|
Project Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on each kind of board and around &2.5 million dollars was saved finally. Responsibility: Being the team leader, I took the job of data analysis, define each member's role, make program plan, coordinate each team member and follow up the progress. |
||||||
| 2006/10—2007/05 | Optimization the current Test Process Order for Flash Memory | |||||
|
Project Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me. Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, organize and implement. |
||||||
| 2006/05—2006/12 | Test Yield of Flash memory Improvement | |||||
|
Project Description: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to avoided unexpected things happen. Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up. |
||||||
| Education and Training | ||||||
| 2005/05—2006/01 | Nanyang University of Science & Technology Microelectronics Doctorate | |||||
| I worked in Nan yang University of Science & Technology as a Research Fellow. I major at Gate oxide Reliability research in the duration. | ||||||
| 2004/03—2005/03 | Seoul National University of Korea Microelectronics Others | |||||
| I had been working in National Physical Lab of Seoul National University in Korea since March of 2004 to March of 2005 as a Post-doctor. Where I unhook the project of research & development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been successfully produced. And one SCI paper about it has been published in Semiconductor Science and Technology. | ||||||
| 2001/03—2004/03 | Shanghai Institute of Microsystems and Information Technology，Chinese Academy of Sciences Information Technology Doctorate | |||||
| 1998/09—2001/03 | Nanjing University of Science & Technology Material Science and Engineering Master | |||||
| Being a master student of this period, I have published one EI paper about Super-fine metal power's electrical characteristics. | ||||||
| 1993/09—1997/07 | Nanjing University of Science & Technology Material Science and Engineering Bachelor | |||||
| 1997/07—1998/07 | Assistant Engineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Henan resistant Engineer in Quality Verification Department | |||||
| Professional Skills | ||||||
| Language Skills： |
English: EXCELLENT Korean: AVERAGE |
|||||
| Computer Skills： |
Technology skilled 96Month SAP understanding 8Month |
|||||
| Certificate： |
2000/11 MCSE 1999/06 CET6 |
|||||
| Self-appraisal | ||||||
| 7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model. | ||||||
【應(yīng)屆生硬件工程師英文簡歷】相關(guān)文章：
硬件工程主管的個(gè)人英文簡歷02-24
硬件工程師的簡歷模板01-21
硬件工程師述職報(bào)告02-18
硬件工程師求職信06-16
硬件工程師面試試題01-30
硬件工程師電子簡歷模板01-17
最新硬件工程師實(shí)習(xí)日記02-18